Chairs: Koji Sugioka, RIKEN Center for Advanced Photonics, Japan Ya Cheng, SIOM, China Felix Sima, Institute of Atomic Physics, Romania

Lasers enable high-quality processing with resolution at the wavelength order. They also offer high flexibility and reducing the number of processing steps by utilizing a direct writing scheme. Furthermore, they often do not require chemicals or process gases, minimizing the environmental load, while can perform diverse processing on a wide range of materials. Due to these characteristics, laser processing is not only actively researched in academic fields but is also already widely utilized in industrial applications. This special session aims to explore the latest developments and future trends in laser materials processing.